Job Descriptions

Job Description

The successful candidate will join the Manufacturing Product Engineering (MPE) Ireland team to deliver die level test solutions for our next generation of microprocessors, chipsets, and communication devices.  The individual will have a solid grounding in the fundamentals of semiconductor electronics, a competence in systems and software, and a passion for learning and solving new problems. MPE Ireland consists of a number of discrete businesses aligned to support our Corporate Strategies across all market segments. Each business has multiple product teams focused on intercepting key product milestones with critical defect screening and stress capability. The individual teams engage directly with design to deliver test solutions to the different facilities across the globe enabling us to create world-changing technology that enriches the lives of every person on earth.

The successful candidate will join Our Ireland Manufacturing Product Engineering (MPE) Ireland developing Test Programs to deliver die level test solutions for our next generation of microprocessors, chipsets, and communication devices The candidate will own Product Health Indicators such as Test Time, Quality (defects per million) and Reliability. Perform silicon debug, defect root causing by cross-referencing outlier results in a large dataset and tweak test algorithm to gain test time or yield. Engage with Design for Test Teams to enable High Volume Manufacturing Test Methodologies.

You will be responsible for:

• Integration, validation and distribution of die level test solutions for our latest microprocessors, chipset & communication devices.

• Development of Test Infrastructure and Validation Tools for a test environment that continues to evolve to support latest process technologies.

• Product Health Indicators (PHI) including Test Time, Fault coverage and Quality.

• Silicon characterisation and debug including test content validation, repeatability and robustness.

• Data analysis to identify trends and opportunities for improvement in yield and test time.

• Engagement with Design for Test (DFT) Teams to enable High Volume Manufacturing Test Methodologies.  

• Partnering with Manufacturing Sites, Yield, Quality & Reliability Teams to drive improvement in product PHIs.  

• Working closely with Test Hardware Teams to develop Automated Test Equipment (ATE) Interface boards.  

Areas of development within the team:

• Semiconductor test methodologies on Digital Circuits (Scan, Functional & Array Testing) and Analog Circuits (DC, IO, High Speed IO & Clock/PLL Testing).

• Digital/Analog Design, Design for Test, Simulation, Emulation, Test Writing and High-Volume Test Development.

• Semiconductor ATE and Interface boards design.

• Programming tools - Perl, Python and other high level programming languages.

• Data Analysis and Statistical Methodologies - JMP and SQL.

• Scrum-Agile development methodologies.

Qualifications

Bachelor's (NFQ Level 8) or Masters (NFQ Level 9) or Doctoral (NFQ Level 10) qualification in Electrical Engineering, Electronic Engineering, Computer Engineering, Physics or similar area.

Key requirements:
A passion for problem solving, learning and being part of a team driven to delight our customers. Strong collaboration and communication skills are essential.

Skills

• Communication Skills
• Problem Solving Skills
• Team Player

Experience

• 2